WAFER CUT DOWN AND SHAPING SERVICES
Wafer cut down and shaping services
Custom wafer thickness and flatness
Waterjet cutting and shaping
Patterned wafer cutting and dicing
Edge trimming
Hole cutting
Prototyping
Round and notch capabilities on small diameters
Laser marking on small diameters
SCRAP WAFER RECYCLING
We can provide a recycling program to repurpose your broken or scrapped whole wafers
CERTIFIED PATTERN WAFER DISTRUCTION
For patterned or IP sensitive wafers, we offer a safe method for destroying wafers
Tier 1 provides a formal certification of the customer products destroyed
SCRAP WAFER RECYCLING
We can provide a recycling program to repurpose your broken or scrapped whole wafers
CERTIFIED PATTERN WAFER DISTRUCTION
For patterned or IP sensitive wafers, we offer a safe method for destroying wafers
Tier 1 provides a formal certification of the customer products destroyed
SPECIALTY GRIND
Single side and double side grinding
Edge grinding and shaping
Wafer thinning down to 75µm
Thick wafers up to 3 mm
Ultra flat single side and double side polished wafers